I want to make a list of options and resulting pros/cons as I am having a hard time to keep track and overview myself.
In general we have two applications (development, production) that have different requirements.
**Option 1:**
Andon Socket
10-30-07A-237-400T4-R27-L14 USD $26.95ea (if we order 500pcs)
Pros:
* relatively simple to assemble and solder on PCB
Cons:
* We would need to mill out the sides after soldering to make space for the cooling metal parts.
* We need to order a high quantity to get good prices
**Option 2:**
237x single pin soldering with CMV12000 defect sample as alignment tool.
$80.90/K (if we order 100K pcs) = 19.17$ per sensor (237 pins per sensor)
Pros:
* good solution for cooling as there is lots of space underneath the sensor for airflow and attaching our cooling heatsinks
Cons:
* We need to find a way to (semi)automate the pin placement and alignment during soldering process.
* We need to order a high quantity to get good prices (its not much cheaper than the Andon socket)
**Option 3:**
Soldering image sensor to PCB directly.
Pros:
* cheapest option
* sensor is made to survive reflow process
* for developers/debugging we can use the ZIF socket and switch to soldering sensors to PCBs for production
Cons:
* attaching heatsink under the sensor gets more tricky (pins are 2.5mm long, PCB is 1.6mm, leaves less than 1mm for heatsink part)
* sensor cannot be replaced (the board plus the sensor is the module which can easily be replaced though so that might not be a problem)
Anything else?